Micro SIDELED® – Flat side-emitting device ideal for compact assembly

Micro SIDELED® - Low height, side emitting LED

Designed to deliver exceptional quality and first-rate reliability, the Micro SIDELED® family from OSRAM Opto Semiconductors offers a choice of sidelookers for applications where space is at a premium. Available in three different heights, 0.6 mm, 0.8 mm and 1.0 mm, these LEDs combine high brightness with low power consumption and include silicone-encapsulated models for an extended product life.

Latest addition
Micro SIDELED® 3806 White

The Micro SIDELED® 3806 White is a sidelooker device. With its small height it is ideal for coupling into flat lightguides. The product is 14% brighter than its predecessor and offers an attractive price / performance ratio.

Micro SIDELED®

  • More design-in flexibility due to availability of white Micro SIDELED® with different heights (1 mm, 0.8 mm, 0.6 mm)
  • Power saving due to low forward voltage and high efficiency
  • High ESD-withstand voltage and if needed, an additional ESD protection diode directly in the casting
  • Side-looking device
  • Flat package
  • High brightness
  • Optimized for coupling into light guide

The white Micro SIDELED® is available in four different heights with silicone encapsulation, which increases the product lifetime dramatically.

Micro SIDELED® 2808

  • Package: white SMT package, colored diffused silicone resin
  • Chip technology: InGaN on Sapphire
  • Typ. Radiation: 120° (Lambertian emitter)
  • Color: Cx = 0.30, Cy = 0.28 acc. to CIE 1931 (● white)
  • Optical efficacy: 45 lm/W
  • Corrosion Robustness Class: 1B
  • ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

Micro SIDELED® 3010

  • Package: white SMT package, colored diffused resin
  • Chip technology: InGaN
  • Typ. Radiation: 120° (horizontal), 120° (vertical)
  • Color: Cx = 0.33, Cy = 0.33 acc. to CIE 1931 (● white)
  • Corrosion Robustness Class: 3B
  • ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
  • Available in white, orange, red, super red, green, true green and yellow

Micro SIDELED® 3806

  • Package: white SMT package, colored diffused silicone resin
  • Chip technology: InGaN on Sapphire
  • Typ. Radiation: 120° (Lambertian emitter)
  • Color: Cx = 0.3050, Cy = 0.3026 acc. to CIE 1931 (● ultra white)
  • Optical efficacy: 180 lm/W
  • Corrosion Robustness Class: 1B
  • ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)

Micro SIDELED® M 4518

To fulfill the needs for pachinko- and gaming applications, this product is especially designed to achieve white binning and to reach high ESD level.

  • Package: SMD package with silicone resin
  • Color: white, x = 0.245, y = 0.23 acc. to CIE 1931 (white)
  • Viewing angle at 50% IV: 120°
  • Chip technology: ThinGaN (true green, blue) / Thinfilm (red)
  • Soldering methods: reflow solderable
  • ESD-withstand voltage: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

Micro SIDELED®

  • Signal and Symbol Luminaries
  • Indicators
  • Effect Light
  • White Goods
  • Gaming
  • Backlighting of phone displays and keypads
  • Backlighting LCDs
  • Optimized coupling into light guides
  • Home Appliances